Result Details

Optimization of Through-hole Plating Method for Prototyping

OTÁHAL, A.; SZENDIUCH, I.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R. Optimization of Through-hole Plating Method for Prototyping. In Abstracts Proceedings, International flash conference IMAPS - Czech and Slovak chapter. ElectroScope - http://www.electroscope.zcu.cz. 2015. no. 1_2016, p. 54-56. ISBN: 978-80-214-5270-1. ISSN: 1802-4564.
Type
conference paper
Language
English
Authors
Otáhal Alexandr, Ing., Ph.D., CF-1-50 (CEITEC), UMEL (FEEC)
Crha Adam, Ing., Ph.D., DCSY (FIT)
Růžička Richard, doc. Ing., Ph.D., MBA, DCSY (FIT)
Szendiuch Ivan, doc. Ing., CSc., RG-1-02 (CEITEC), UMEL (FEEC)
Šimek Václav, Ing., DCSY (FIT)
Abstract

Article discusses the enhancement methods of plating through holes on printed circuit boards. Novum was the addition of vacuum or/and ultrasound during the activation process before the surface metallization. For the copper plating method was used reverse pulse plating.

Keywords

Through-hole plating, PCB

Published
2015
Pages
54–56
Journal
ElectroScope - http://www.electroscope.zcu.cz, vol. IfC 2015, no. 1_2016, ISSN 1802-4564
Proceedings
Abstracts Proceedings, International flash conference IMAPS - Czech and Slovak chapter
Conference
IMAPS flash Conference 2015
ISBN
978-80-214-5270-1
BibTeX
@inproceedings{BUT120369,
  author="Alexandr {Otáhal} and Adam {Crha} and Richard {Růžička} and Ivan {Szendiuch} and Václav {Šimek}",
  title="Optimization of Through-hole Plating Method for Prototyping",
  booktitle="Abstracts Proceedings, International flash conference IMAPS - Czech and Slovak chapter",
  year="2015",
  journal="ElectroScope - http://www.electroscope.zcu.cz",
  volume="IfC 2015",
  number="1_2016",
  pages="54--56",
  isbn="978-80-214-5270-1",
  issn="1802-4564"
}
Projects
Innovation of the equipment for fabriacation of multilayer PCBs, BUT, Vnitřní projekty VUT, FEKT/FIT-J-15-2832, start: 2015-01-01, end: 2015-12-31, completed
Departments
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