Result Details

Anodic bonding process in MEMS applications

PEKÁREK, J.; VRBA, R.; MAGÁT, M. Anodic bonding process in MEMS applications. In Proceedings of 8th international conference KRÁLÍKY 2010. Tiskárna Atom, Ltd. Chuchelna 254, Semily: Brno University of Technology, Faculty of Electrical Engineering and Communication, 2010. p. 103-105. ISBN: 978-80-214-4139-2.
Type
conference paper
Language
English
Authors
Pekárek Jan, doc. Ing., Ph.D., UMEL (FEEC)
Vrba Radimír, prof. Ing., CSc., CEITEC (CEITEC), UMEL (FEEC)
Magát Martin, Ing., Ph.D., UMEL (FEEC)
Abstract

Anodic bonding is a method for joining glass to silicon. It is one of the important steps for packaging MEMS components. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the colour to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass.

Keywords

Anodic bonding, packaging, micro electro-mechanical systems (MEMS).

Published
2010
Pages
103–105
Proceedings
Proceedings of 8th international conference KRÁLÍKY 2010
Edition
1.
Conference
IEEE Workshop Králíky 2010
ISBN
978-80-214-4139-2
Publisher
Brno University of Technology, Faculty of Electrical Engineering and Communication
Place
Tiskárna Atom, Ltd. Chuchelna 254, Semily
BibTeX 
@inproceedings{BUT34624,
  author="Jan {Pekárek} and Radimír {Vrba} and Martin {Magát}",
  title="Anodic bonding process in MEMS applications",
  booktitle="Proceedings of 8th international conference KRÁLÍKY 2010",
  year="2010",
  number="1.",
  pages="103--105",
  publisher="Brno University of Technology, Faculty of Electrical Engineering and Communication",
  address="Tiskárna Atom, Ltd.
Chuchelna 254, Semily",
  isbn="978-80-214-4139-2"
}
Departments
Department of Microelectronics (UMEL)
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