Result Details
Carbon nanostructures used in capacitive sensors as the surface increase element
PEKÁREK, J.; VRBA, R.; FICEK, R.; MAGÁT, M. Carbon nanostructures used in capacitive sensors as the surface increase element. In SIITME 2009, 15th International Symposium for Design and Technology of Electronics Packages, Conference Proceedings. 1. Budapest: Budapest University of Technology and Economics, Budapest, Hungary, 2009. p. 323-326. ISBN: 978-1-4244-5132-6.
Type
conference paper
Language
English
Authors
Pekárek Jan, doc. Ing., Ph.D., UMEL (FEEC)
Vrba Radimír, prof. Ing., CSc., RE-KancQ (RO), UMEL (FEEC)
Ficek Richard, Ing., UMEL (FEEC)
Magát Martin, Ing., Ph.D., UMEL (FEEC)
Vrba Radimír, prof. Ing., CSc., RE-KancQ (RO), UMEL (FEEC)
Ficek Richard, Ing., UMEL (FEEC)
Magát Martin, Ing., Ph.D., UMEL (FEEC)
Abstract
Novel pressure sensor has been achieved utilizing carbon nanotubes (CNTs) arrays as the surface increase element in capacitive sensors. The CNTs were grown by plasma enhanced chemical vapor deposition (PECVD) by using iron as a catalyst in an atmospheric pressure microwave torch. The capacitive sensor takes advantage of CNTs dimensions to increase the surface. This means that the CNTs arrays in the capacitive sensors increase the surface of the electrodes, which are similar to a plate capacitor.
Keywords
Pressure sensor, carbon nanotubes, plasma enhanced chemical vapor deposition
Published
2009
Pages
323–326
Proceedings
SIITME 2009, 15th International Symposium for Design and Technology of Electronics Packages, Conference Proceedings
Series
1.
Conference
15th International Symposium for Design and Technology of Electronics Packages, SIITME 2009
ISBN
978-1-4244-5132-6
Publisher
Budapest University of Technology and Economics, Budapest, Hungary
Place
Budapest
BibTeX
@inproceedings{BUT33190,
author="Jan {Pekárek} and Radimír {Vrba} and Richard {Ficek} and Martin {Magát}",
title="Carbon nanostructures used in capacitive sensors as the surface increase element",
booktitle="SIITME 2009, 15th International Symposium for Design and Technology of Electronics Packages, Conference Proceedings",
year="2009",
series="1.",
pages="323--326",
publisher="Budapest University of Technology and Economics, Budapest, Hungary",
address="Budapest",
isbn="978-1-4244-5132-6"
}
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