Result Details

A Novel Laboratory Anodic Bonding Device for MEMS Applications

HÁZE, J.; VRBA, R.; PAVLÍK, M.; PEKÁREK, J. A Novel Laboratory Anodic Bonding Device for MEMS Applications. ElectroScope - http://www.electroscope.zcu.cz, 2010, vol. 2010, no. 3, p. 24-26. ISSN: 1802-4564.
Type
journal article
Language
English
Authors
Háze Jiří, doc. Ing., Ph.D., UMEL (FEEC)
Vrba Radimír, prof. Ing., CSc., CEITEC (CEITEC), UMEL (FEEC)
Pavlík Michal, Ing., Ph.D., UMEL (FEEC)
Pekárek Jan, doc. Ing., Ph.D., UMEL (FEEC)
Abstract

The article deals with a novel laboratory anodic bonding device. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. It is one of the important steps of MEMS components packaging. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass.

Keywords

anodic bonding, MEMS

Published
2010
Pages
24–26
Journal
ElectroScope - http://www.electroscope.zcu.cz, vol. 2010, no. 3, ISSN 1802-4564
Publisher
ZCU Plzeň
Place
Plzeň
BibTeX 
@article{BUT50401,
  author="Jiří {Háze} and Radimír {Vrba} and Michal {Pavlík} and Jan {Pekárek}",
  title="A Novel Laboratory Anodic Bonding Device for MEMS Applications",
  journal="ElectroScope - http://www.electroscope.zcu.cz",
  year="2010",
  volume="2010",
  number="3",
  pages="24--26",
  issn="1802-4564"
}
Departments
Department of Microelectronics (UMEL)
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