Detail výsledku

A Novel Laboratory Anodic Bonding Device for MEMS Applications

HÁZE, J.; VRBA, R.; PAVLÍK, M.; PEKÁREK, J. A Novel Laboratory Anodic Bonding Device for MEMS Applications. ElectroScope - http://www.electroscope.zcu.cz, 2010, vol. 2010, no. 3, p. 24-26. ISSN: 1802-4564.
Typ
článek v časopise
Jazyk
anglicky
Autoři
Háze Jiří, doc. Ing., Ph.D., UMEL (FEKT)
Vrba Radimír, prof. Ing., CSc., CEITEC VUT (CEITEC VUT), UMEL (FEKT)
Pavlík Michal, Ing., Ph.D., UMEL (FEKT)
Pekárek Jan, doc. Ing., Ph.D., UMEL (FEKT)
Abstrakt

The article deals with a novel laboratory anodic bonding device. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. It is one of the important steps of MEMS components packaging. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass.

Klíčová slova

anodic bonding, MEMS

Rok
2010
Strany
24–26
Časopis
ElectroScope - http://www.electroscope.zcu.cz, roč. 2010, č. 3, ISSN 1802-4564
Vydavatel
ZCU Plzeň
Místo
Plzeň
BibTeX 
@article{BUT50401,
  author="Jiří {Háze} and Radimír {Vrba} and Michal {Pavlík} and Jan {Pekárek}",
  title="A Novel Laboratory Anodic Bonding Device for MEMS Applications",
  journal="ElectroScope - http://www.electroscope.zcu.cz",
  year="2010",
  volume="2010",
  number="3",
  pages="24--26",
  issn="1802-4564"
}
Pracoviště
Ústav mikroelektroniky (UMEL)
Nahoru