Result Details

Testing of Novel Device for Anodic Bonding process in MEMS Application

PEKÁREK, J.; VRBA, R.; MAGÁT, M.; PAVLÍK, M.; HÁZE, J. Testing of Novel Device for Anodic Bonding process in MEMS Application. Electronics, 2011, vol. 5, no. 2, p. 180-182. ISSN: 1313-1842.
Type
journal article
Language
English
Authors
Pekárek Jan, doc. Ing., Ph.D., FBM (FBM), UMEL (FEEC)
Vrba Radimír, prof. Ing., CSc., CEITEC (CEITEC), UMEL (FEEC)
Magát Martin, Ing., Ph.D., UMEL (FEEC)
Pavlík Michal, Ing., Ph.D., UMEL (FEEC)
Háze Jiří, doc. Ing., Ph.D., UMEL (FEEC)
Abstract

The paper describes first testing of novel device for anodic bonding process. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass

Keywords

Anodic bonding process, micro electro-mechanical systems (MEMS), tensile test.

Published
2011
Pages
180–182
Journal
Electronics, vol. 5, no. 2, ISSN 1313-1842
Publisher
Faculty of Electronic Engineering and Technologies, Technical University of Sofia
Place
Sofia
UT WoS
000411865200091
BibTeX 
@article{BUT73584,
  author="Jan {Pekárek} and Radimír {Vrba} and Martin {Magát} and Michal {Pavlík} and Jiří {Háze}",
  title="Testing of Novel Device for Anodic Bonding process in MEMS Application",
  journal="Electronics",
  year="2011",
  volume="5",
  number="2",
  pages="180--182",
  issn="1313-1842"
}
Departments
Smart Nanodevices (RG-1-02)
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