Detail výsledku

Testing of Novel Device for Anodic Bonding process in MEMS Application

PEKÁREK, J.; VRBA, R.; MAGÁT, M.; PAVLÍK, M.; HÁZE, J. Testing of Novel Device for Anodic Bonding process in MEMS Application. Electronics, 2011, vol. 5, no. 2, p. 180-182. ISSN: 1313-1842.
Typ
článek v časopise
Jazyk
anglicky
Autoři
Pekárek Jan, doc. Ing., Ph.D., FP (FP), UMEL (FEKT)
Vrba Radimír, prof. Ing., CSc., CEITEC VUT (CEITEC VUT), UMEL (FEKT)
Magát Martin, Ing., Ph.D., UMEL (FEKT)
Pavlík Michal, Ing., Ph.D., UMEL (FEKT)
Háze Jiří, doc. Ing., Ph.D., UMEL (FEKT)
Abstrakt

The paper describes first testing of novel device for anodic bonding process. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass

Klíčová slova

Anodic bonding process, micro electro-mechanical systems (MEMS), tensile test.

Rok
2011
Strany
180–182
Časopis
Electronics, roč. 5, č. 2, ISSN 1313-1842
Vydavatel
Faculty of Electronic Engineering and Technologies, Technical University of Sofia
Místo
Sofia
UT WoS
000411865200091
BibTeX 
@article{BUT73584,
  author="Jan {Pekárek} and Radimír {Vrba} and Martin {Magát} and Michal {Pavlík} and Jiří {Háze}",
  title="Testing of Novel Device for Anodic Bonding process in MEMS Application",
  journal="Electronics",
  year="2011",
  volume="5",
  number="2",
  pages="180--182",
  issn="1313-1842"
}
Pracoviště
Chytré nanonástroje (RG-1-02)
Nahoru