Result Details

ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING

OTÁHAL, A.; CRHA, A.; ŠIMEK, V.; RŮŽIČKA, R.; SZENDIUCH, I. ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING. Proceedings of the 22nd Conference STUDENT EEICT 2016. Brno: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií, 2016. p. 610-614. ISBN: 978-80-214-5350-0.
Type
conference paper
Language
English
Authors
Otáhal Alexandr, Ing., Ph.D., UMEL (FEEC)
Crha Adam, Ing., Ph.D., DCSY (FIT)
Šimek Václav, Ing., DCSY (FIT)
Růžička Richard, doc. Ing., Ph.D., MBA, DCSY (FIT)
Szendiuch Ivan, doc. Ing., CSc., UMEL (FEEC)
Abstract

This paper deals with optimizing of copper plating process for manufacturing of small-scale industries of printed circuit boards. Main discussed procedure in this paper is activation of printed circuit board surface for conformal copper plated surface of through holes. Innova-tive part of process was activating of holes surface with utilization of vacuum (lower pres-sure) and ultrasound. It helps reduce unplated edge of hole.

Keywords

Through-hole, reverse pulse plating, copper plating, PCB

Published
2016
Pages
610–614
Proceedings
Proceedings of the 22nd Conference STUDENT EEICT 2016
Conference
Student EEICT 2016
ISBN
978-80-214-5350-0
Publisher
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Place
Brno
BibTeX
@inproceedings{BUT124490,
  author="Alexandr {Otáhal} and Adam {Crha} and Václav {Šimek} and Richard {Růžička} and Ivan {Szendiuch}",
  title="ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING",
  booktitle="Proceedings of the 22nd Conference STUDENT EEICT 2016",
  year="2016",
  pages="610--614",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  address="Brno",
  isbn="978-80-214-5350-0"
}
Projects
Innovation of the equipment for fabriacation of multilayer PCBs, BUT, Vnitřní projekty VUT, FEKT/FIT-J-15-2832, start: 2015-01-01, end: 2015-12-31, completed
Departments
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