Course details

Design and Fabrication of Electronic Instruments

BPC-NRP FEKT BPC-NRP Acad. year 2022/2023 Winter semester 6 credits

Current academic year

Design and demands on electronic instruments and its manufacturing. Security of measuring instruments against unfavourable external and internal influences. The take away of heat from instrument case. Security of persons against accidents caused by electricity. Grounding and shielding. Ergonometry of measuring instruments. Technical diagnostics.


Language of instruction




Time span

  • 26 hrs lectures
  • 26 hrs laboratories




Subject specific learning outcomes and competences

The graduate is able to:
- describe the basic principles of an industrial property protection,
- explain the production technology preparation,
- describe the used method of electromagnetic compatibility (EMC),
- describe the used ensurings of signal distribution,
- select appropriate power source distribution on the basis of given requirements,
- name individually parazitic couplings and transfers in electronic circuits,
- explain principles of shielding,
- explain principles of thermal management,
- describe and explain individual methods of soldering,
- discuss principal possibilities of printed circuit boards,
- discuss advantages and disadvantages of surface mount technology,
- estimate respectably safety requirements for electronic equipments,
- describe the used method of diagnostics,
- discuss advantages and disadvantages of quality management methods.

Learning objectives

To be introduced to practicle principles of designing electronic instruments and devices as regards both electrical and mechanical aspects - in the industrial environment.
The student acquires concrete application knowledge of electronic instrument design, which is otherwise obtained through long-term development practice. Emphasis is laid on understanding the physical essence of parasitic events so that their knowledge can be applied to other cases. He learns to foresee and anticipate the appearance of many problems arising in the development of new instruments in both the electrical and the mechanical part of the design.

Prerequisite knowledge and skills

The subject knowledge on the secondary school level is required.

Syllabus of lectures

Demands on electronic instruments and systems. Design methodology, technical documentation. Design of signal lines: symmetrical and non-symmetrical lines, properties of signal lines, execution of connections, printed circuits and their properties, optical lines.
Supply sources: mains supply, mains switches, transformers, means of interference suppression (suppression capacitors, suppression chokes, suppression elements). Supply voltage distribution: supply distribution in instrument housing and on printed circuit boards, distribution in the ground, galvanic separation of systems (impulse tranformers, optrons).
Parasitic events and their suppression: coupling in input and outtput circuits, coupling on line resistances, parasitic capacitances and inductances, transient resistances, thermoelectric voltage, overvoltage on inductive load.
Signal transmission over long lines: reflections in the lines, crosstalk, charging and discharging the lines.
Electric and magnetic field screening: electric field screening of systems and lines, magnetic field screening of systems and lines. Equipotential guarding: insulation ring guarding, teflon support point, examples of active insulation of critical points.
Selection of discrete components and application recommendation: resistors, potentiometers and potentiometric trimmers, capacotors and capacitive trimmers, inductors, diodes, transistors (bipolar, unipolar; power, HF).
Application recommendation for analog and digital integrated circuits: operational and transimpedance amplifiers, analog multiplexersand demultiplexers, comparators and timers, D/A and A/D converters, digital integrated circuits, microprocessors.
Mechanics design: regulation and control elements and their lay-out, communication and indication elements, lay-out of regulation and communication elements on the front panel of the instrument, graphic and technical aspects of the mechanical part of design, design of instrument housing.
Mechanical resistance of devices: resistance to shocks, vibration, moisture, water; abstraction of heat from the device, cooling elements, temperature stabilization (thermostatic control).
Connection of conductors and components: technology of printed circuit production, soldered.connections, wire-wrap connections, cut-in connections; technology of surface assembly.
Safety requirements: fundamental requirements, types of instrument classes, work environment, danger-to-touch protection, insulation requirements, surface paths and distances, movable liead-in wires.
Reliability of electronic instruments. Technical diagnostics and debugging of electronic instruments.
Quality management. Information in electronics, its collection and processing. Catalogues, electronic databases.

Progress assessment

Practicals - 40 points.
Final exam - 60 points.

Teaching methods and criteria

Teaching methods include lectures and computer laboratories. The course is taking materials at the web pages. Students have to prepare one project/assignment during the course.

Controlled instruction

The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.

Course inclusion in study plans

  • Programme BIT, 2nd year of study, Elective
  • Programme IT-BC-3, field BIT, 2nd year of study, Elective
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