Result Details

Innovative Methods for Through Holes Plating

OTÁHAL, A.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R.; SZENDIUCH, I. Innovative Methods for Through Holes Plating. In 2016 39th International Spring Seminar on Electronics Technology (ISSE). Conference proceedings (International Spring Seminar on Electronics Technology). Pilsen, Czech Republic: University of West Bohemia, 2016. p. 48-52. ISBN: 978-1-5090-1389-0. ISSN: 2161-2536.
Type
conference paper
Language
English
Authors
Otáhal Alexandr, Ing., Ph.D., UMEL (FEEC)
Šimek Václav, Ing., DCSY (FIT)
Crha Adam, Ing., Ph.D., DCSY (FIT)
Růžička Richard, doc. Ing., Ph.D., MBA, DCSY (FIT)
Szendiuch Ivan, doc. Ing., CSc., UMEL (FEEC)
Abstract

The main aim of this work was to investigate the influence of additional parameters in plating process of through-holes technology for PCBs. Vacuum, ultrasound and the combination of both was used during the activation process of hole´s surface. Therefore, research was focused on the activation process, which was revealed as the cause of plating problems. The samples used in this work were prepared with reverse pulse plating.

Keywords

Copper plating, through-hole technology, printed circuit board, vacuum, ultrasound

Published
2016
Pages
48–52
Journal
Conference proceedings (International Spring Seminar on Electronics Technology), ISSN 2161-2536
Proceedings
2016 39th International Spring Seminar on Electronics Technology (ISSE)
Conference
39th International Spring Seminar on Electronics Technology
ISBN
978-1-5090-1389-0
Publisher
University of West Bohemia
Place
Pilsen, Czech Republic
DOI
10.1109/ISSE.2016.7563159
UT WoS
000387089800010
EID Scopus
2-s2.0-84988874399
BibTeX 
@inproceedings{BUT126050,
  author="Alexandr {Otáhal} and Václav {Šimek} and Adam {Crha} and Richard {Růžička} and Ivan {Szendiuch}",
  title="Innovative Methods for Through Holes Plating",
  booktitle="2016 39th International Spring Seminar on Electronics Technology (ISSE)",
  year="2016",
  journal="Conference proceedings (International Spring Seminar on Electronics Technology)",
  pages="48--52",
  publisher="University of West Bohemia",
  address="Pilsen, Czech Republic",
  doi="10.1109/ISSE.2016.7563159",
  isbn="978-1-5090-1389-0"
}
Projects
Innovation of the equipment for fabriacation of multilayer PCBs, BUT, Vnitřní projekty VUT, FEKT/FIT-J-15-2832, start: 2015-01-01, end: 2015-12-31, completed
Research groups
Unconventional Digital Circuits Research Group (RG POLY)
Departments
Department of Microelectronics (UMEL)
Faculty of Information Technology (FIT)
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