Detail výsledku

Innovative Methods for Through Holes Plating

OTÁHAL, A.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R.; SZENDIUCH, I. Innovative Methods for Through Holes Plating. In 2016 39th International Spring Seminar on Electronics Technology (ISSE). Conference proceedings (International Spring Seminar on Electronics Technology). Pilsen, Czech Republic: University of West Bohemia, 2016. p. 48-52. ISBN: 978-1-5090-1389-0. ISSN: 2161-2536.
Typ
článek ve sborníku konference
Jazyk
anglicky
Autoři
Otáhal Alexandr, Ing., Ph.D., UMEL (FEKT)
Šimek Václav, Ing., UPSY (FIT)
Crha Adam, Ing., Ph.D., UPSY (FIT)
Růžička Richard, doc. Ing., Ph.D., MBA, UPSY (FIT)
Szendiuch Ivan, doc. Ing., CSc., UMEL (FEKT)
Abstrakt

The main aim of this work was to investigate the influence of additional parameters in plating process of through-holes technology for PCBs. Vacuum, ultrasound and the combination of both was used during the activation process of hole´s surface. Therefore, research was focused on the activation process, which was revealed as the cause of plating problems. The samples used in this work were prepared with reverse pulse plating.

Klíčová slova

Copper plating, through-hole technology, printed circuit board, vacuum, ultrasound

Rok
2016
Strany
48–52
Časopis
Conference proceedings (International Spring Seminar on Electronics Technology), ISSN 2161-2536
Sborník
2016 39th International Spring Seminar on Electronics Technology (ISSE)
Konference
39th International Spring Seminar on Electronics Technology
ISBN
978-1-5090-1389-0
Vydavatel
University of West Bohemia
Místo
Pilsen, Czech Republic
DOI
10.1109/ISSE.2016.7563159
UT WoS
000387089800010
EID Scopus
2-s2.0-84988874399
BibTeX 
@inproceedings{BUT126050,
  author="Alexandr {Otáhal} and Václav {Šimek} and Adam {Crha} and Richard {Růžička} and Ivan {Szendiuch}",
  title="Innovative Methods for Through Holes Plating",
  booktitle="2016 39th International Spring Seminar on Electronics Technology (ISSE)",
  year="2016",
  journal="Conference proceedings (International Spring Seminar on Electronics Technology)",
  pages="48--52",
  publisher="University of West Bohemia",
  address="Pilsen, Czech Republic",
  doi="10.1109/ISSE.2016.7563159",
  isbn="978-1-5090-1389-0"
}
Projekty
Inovace výrobní linky pro tvorbu vícevrstvých desek plošných spojů, VUT, Vnitřní projekty VUT, FEKT/FIT-J-15-2832, zahájení: 2015-01-01, ukončení: 2015-12-31, ukončen
Výzkumné skupiny
Výzkumná skupina Nekonvenční číslicové obvody (VZ POLY)
Pracoviště
Fakulta informačních technologií (FIT)
Ústav mikroelektroniky (UMEL)
Nahoru