Publication Details

Innovative Methods in Activation Process of Through-hole Plating

OTÁHAL Alexandr, ŠIMEK Václav, CRHA Adam, RŮŽIČKA Richard and SZENDIUCH Ivan. Innovative Methods in Activation Process of Through-hole Plating. Periodica Polytechnica Electrical Engineering and Computer Science, vol. 60, no. 4, pp. 217-222. ISSN 2064-5279. Available from: https://pp.bme.hu/eecs/article/view/9686
Czech title
Inovativní metody v procesu aktivace povrchu prokovovaných děr
Type
journal article
Language
english
Authors
Otáhal Alexandr, Ing. (FEEC BUT)
Šimek Václav, Ing. (DCSY FIT BUT)
Crha Adam, Ing. (DCSY FIT BUT)
Růžička Richard, doc. Ing., Ph.D., MBA (DCSY FIT BUT)
Szendiuch Ivan, Doc. Ing., CSc. (UMEL FEEC BUT)
URL
Keywords

Plated-through holes, PCB activation, reverse pulse plating, vacuum, ultrasound.

Abstract

This paper is dealing with an in-depth verification of innovated activation methods, where the phase of surface treatment involves solvent with oxides of carbon as the core chemistry. The overall impact of solvent on through-hole copper plating process was tested on target t structures involving standard FR-4 PCB substrate. The novelty of the approach proposed here is based on the effect of an unusual combination of vacuum and ultrasound waves in order to enhance quality of the activation process. The results undoubtedly demonstrated significant benefits of vacuum and vacuum/ultrasound combination on the decreasing number of defects, which normally occurred during the conventional plating process. In addition, there was also discovered that the resulting number of failures was increased even despite the use of ultrasound.

Published
2016
Pages
217-222
Journal
Periodica Polytechnica Electrical Engineering and Computer Science, vol. 60, no. 4, ISSN 2064-5279
Publisher
Budapest University of Technology and Economics
DOI
EID Scopus
BibTeX
@ARTICLE{FITPUB11341,
   author = "Alexandr Ot\'{a}hal and V\'{a}clav \v{S}imek and Adam Crha and Richard R\r{u}\v{z}i\v{c}ka and Ivan Szendiuch",
   title = "Innovative Methods in Activation Process of Through-hole Plating",
   pages = "217--222",
   journal = "Periodica Polytechnica Electrical Engineering and Computer Science",
   volume = 60,
   number = 4,
   year = 2016,
   ISSN = "2064-5279",
   doi = "10.3311/PPee.9686",
   language = "english",
   url = "https://www.fit.vut.cz/research/publication/11341"
}
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