Detail výsledku

Frequency Domain Zadoff-Chu SoundingTechnique for USRPs

KASSEM, E.; MARŠÁLEK, R.; BLUMENSTEIN, J. Frequency Domain Zadoff-Chu SoundingTechnique for USRPs. In Proceedings of International Conference on Telecommunications (ICT 2018). Institute of Electrical and Electronics Engineers Inc., 2018. p. 302-306. ISBN: 978-1-5386-2320-6.
Typ
článek ve sborníku konference
Jazyk
anglicky
Autoři
Kassem Edward, Ph.D.
Maršálek Roman, prof. Ing., Ph.D., UREL (FEKT)
Blumenstein Jiří, doc. Ing., Ph.D., UREL (FEKT)
Abstrakt

This paper proposes a technique for a wireless channel sounding and shows its real-world measurement results. The proposed technique is exploited to characterize different indoor channels for a 800-900 MHz band. We utilize an Universal Software Radio Peripheral (USRP) and GNU Radio software. At the transmitter side, Zadoff-Chu sequence is generated and sent across the channel, while the carrier frequency of the transmitted sequence is swept across the measured bandwidth. The achieved response is also compared with the frequency domain technique, where continuous wave is used as a sounding signal. Using the proposed method, the basic channel characteristics like RMS delay spread, mean excess delay, path-loss and coherence bandwidth are extracted in shorter time period compared to the continuous wave method.

Klíčová slova

channel sounding, D2D, USRP, Zadoff-Chu.

URL
Rok
2018
Strany
302–306
Sborník
Proceedings of International Conference on Telecommunications (ICT 2018)
Konference
25th International Conference on Telecommunications (ICT) 2018
ISBN
978-1-5386-2320-6
Vydavatel
Institute of Electrical and Electronics Engineers Inc.
DOI
UT WoS
000446016500056
EID Scopus
BibTeX
@inproceedings{BUT149678,
  author="Edward {Kassem} and Roman {Maršálek} and Jiří {Blumenstein}",
  title="Frequency Domain Zadoff-Chu SoundingTechnique for USRPs",
  booktitle="Proceedings of International Conference on Telecommunications (ICT 2018)",
  year="2018",
  pages="302--306",
  publisher="Institute of Electrical and Electronics Engineers Inc.",
  doi="10.1109/ICT.2018.8464940",
  isbn="978-1-5386-2320-6",
  url="https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8464940"
}
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