Detail výsledku

Textile microwave substrates: Special types of 3D knitted materials

KRÁČALOVÁ, D.; PROCHÁZKA, J.; LÉDROVÁ, Z.; RAIDA, Z.; LÁČÍK, J.; DŘÍNOVSKÝ, J.; CUPAL, M. Textile microwave substrates: Special types of 3D knitted materials. In 2020 23rd International Microwave and Radar Conference (MIKON). NEW YORK: IEEE, 2020. p. 237-240. ISBN: 978-83-949421-7-5.
Typ
článek ve sborníku konference
Jazyk
anglicky
Autoři
Kráčalová Dita
Procházka Jiří
Lédrová Zdeňka
Raida Zbyněk, prof. Dr. Ing., REL-SIX (FEKT), UREL (FEKT)
Láčík Jaroslav, doc. Ing., Ph.D., UREL (FEKT)
Dřínovský Jiří, Ing., Ph.D., UREL (FEKT), UTKO (FEKT)
Cupal Miroslav, Ing., Ph.D., UREL (FEKT)
Abstrakt

The paper summarizes the experience with the development, production and optimization of 3D fabrics, specifically 3D weft knitted fabrics, planned for the integration of electronic components. Attention is focused on the presentation of 3D fabrics general properties which are given by their structure, used materials and finishing. The technological possibilities of preparation of this type of fabrics are summarized and their limits are described in detail and possible application areas are outlined. The possibilities of surface treatment from coating, lamination to printing or embossing are presented in order to optimize the fabric surface for a given application.

Klíčová slova

3D fabric; 3D weft knitted fabric; spacer fabric; distance fabric; technical fabric; functional fabric; antistatic fabric; textile substrate

URL
Rok
2020
Strany
237–240
Sborník
2020 23rd International Microwave and Radar Conference (MIKON)
Konference
Microwave and Radar Week (MIKON 2020)
ISBN
978-83-949421-7-5
Vydavatel
IEEE
Místo
NEW YORK
DOI
UT WoS
000646195700055
EID Scopus
BibTeX
@inproceedings{BUT177235,
  author="Dita {Kráčalová} and Jiří {Procházka} and Zdeňka {Lédrová} and Zbyněk {Raida} and Jaroslav {Láčík} and Jiří {Dřínovský} and Miroslav {Cupal}",
  title="Textile microwave substrates: Special types of 3D knitted materials",
  booktitle="2020 23rd International Microwave and Radar Conference (MIKON)",
  year="2020",
  pages="237--240",
  publisher="IEEE",
  address="NEW YORK",
  doi="10.23919/MIKON48703.2020.9253942",
  isbn="978-83-949421-7-5",
  url="https://ieeexplore.ieee.org/abstract/document/9253942"
}
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